Visionary Seminar: Smart Packaging

Today, a package has the function to handle the packaged goods and to support advertisement and information. Tomorrow, a package will become a smart product on its own. It will smell freshness and release odours, it will talk and display interactively with individual customers, it will monitor and store the history of transportation, it will actively combat theft and counterfeit, it will take an active role in the logistic chain. The technologies that will enable such smart packages at the right cost, derive from currently used colour printing as well as from advanced technologies and packaging concepts of micro-electronics.

Four internationally recognized experts will provide us with their vision of the future. On the one hand, they will explore the technological horizons of packaging, enabled by printing and micro-electronics. Next to that, we will be informed about the economics of smart packaging from an end-user perspective.

Program
- 17h15 Welcoming the participants
- 17h45 Introduction - Opportunities and new technologies in the packaging industry - Paul Heremans (Department Director NEXT, IMEC)
- 18h00 Smart labels versus smart packaging - Jacques Reynders (CEO, Reynders Etiketten)
- 18h30 Disappearing Electronics - New Applications for Si-chips and related packaging challenges - Werner Weber (Senior Director Corporate Research, Infineon Technologies)
- 19h00 Sandwich break
- 19h30 Towards printed electronics: polymer-based RFID tags - Wolfgang Clemens (Head of Applications, PolyIC)
- 20h00 Smart packaging: a retailer perspective - Edwin Birnbaum (CEO, Clarity Advisers)
- 20h30 Questions and answers
- 20h50 Drink

Practical details
Date: Monday February 21, 2005 (17h45-20h50)
Location: IMEC Auditorium, Kapeldreef 75, 3001 Leuven