Imec demonstrates 896Gb/s silicon photonics transceiver

Driven by exponential demand for interconnect bandwidth in datacenters, single-mode optical transceivers will need to scale to Tb/s capacity and be tightly integrated with network switches. Silicon photonics (SiPh) has been identified as a promising technology platform to realize such aggressive bandwidth and integration targets, substantially going beyond 100Gb/s technology available today. In the work presented at OFC, imec combines recently developed 50GHz active optical components with a multi-core fiber interface to showcase a proof-of-concept 896Gb/s spatial-division multiplexing SiPh transceiver.          

The bi-directional 896Gb/s silicon photonics transceiver combines dense arrays of 56Gb/s Germanium-Silicon (GeSi) electro-absorption modulators and GeSi waveguide photodetectors with a multi-core fiber interface. It comprises arrays of 16 GeSi electro-absorption modulators (EAM) and 16 GeSi photodetectors (PD), implemented with 100µm channel pitch on a single silicon chip. Both the EAM and PD devices are realized in a single GeSi epitaxial growth step, allowing a simple fabrication scheme. The chip co-integrates optical power splitters to feed a single laser source to the transmitter channels, and a dense array of fiber grating couplers to interface with a pitch reducing optical fiber array (PROFA), provided and packaged by Chiral Photonics.

“We obtained clear and wide open eye diagrams at 56Gb/s non-return-to-zero on-off keying (NRZ-OOK) data rate, for all EAM and PD channels tested in a loop-back transmission experiment,” said Joris Van Campenhout, director of the Optical I/O R&D program at imec. “These results clearly show the potential to realize ultra-compact multi-channel optical transceivers in imec’s 50G silicon photonics platform, targeting future Tb/s-scale interconnects.”

The GeSi EAM and PD components are available for evaluation by companies and academia through imec’s silicon photonics prototyping service and the iSiPP50G multi-project wafer (MPW) service provided by Europractice. The iSiPP50G platform includes a validated passive and active device library and is supported by photonic design software solutions from multiple EDA vendors, including Synopsys, Luceda Photonics and Lumerical, in current or upcoming releases.

The Europractice MPW services target datacom, telecom and sensing industries, photonic ASIC ecosystems and academia in the mentioned fields. In 2017, new MPW runs are available at four fixed tape-in dates. First closing date for registering to iSiPP50G technologies is May 5, 2017.

PROFAs and full optoelectronic packaging services are available from Chiral Photonics (OFC Booth 3714).
 

About imec

Imec is the world-leading research and innovation hub in nano-electronics and digital technologies. The combination of our widely acclaimed leadership in microchip technology and profound software and ICT expertise is what makes us unique. By leveraging our world-class infrastructure and local and global ecosystem of partners across a multitude of industries, we create groundbreaking innovation in application domains such as healthcare, smart cities and mobility, logistics and manufacturing, and energy.

As a trusted partner for companies, start-ups and universities we bring together close to 3,500 brilliant minds from over 70 nationalities. Imec is headquartered in Leuven, Belgium and also has distributed R&D groups at a number of Flemish universities, in the Netherlands, Taiwan, USA, China, and offices in India and Japan. In 2015, imec's revenue (P&L) totaled 415 million euro and of iMinds which is integrated in imec as of September 21, 2016 52 million euro. Further information on imec can be found at http://www.imec-int.com/

Imec is a registered trademark for the activities of IMEC International (a legal entity set up under Belgian law as a "stichting van openbaar nut”), imec Belgium (IMEC vzw supported by the Flemish Government), imec the Netherlands (Stichting IMEC Nederland, part of Holst Centre which is supported by the Dutch Government), imec Taiwan (IMEC Taiwan Co.) and imec China (IMEC Microelectronics (Shanghai) Co. Ltd.) and imec India (Imec India Private Limited), imec Florida (IMEC USA nanoelectronics design center).

 

Contact:

Hanne Degans, Press Officer, +32 16 28 17 69// +32 486 06 51 75// Hanne.Degans@imec.be